Totowa, NJ - Jan 10, 2012 - ECI Technology announced shipment of 20 Quali-Fill® Chemical Management Systems for TSV Electroplating and Electroless chemistries in 2011.
“It is very exciting, that ECI is in a position to bring its expertise into new and extremely challenging processes,” said Marianna Rabinovitch, ECI Technology CEO in a recent statement. “Manufacturers worldwide are planning to move into high volume production with TSV for 3D architectures on future generations of chips. The Quali-Fill® Chemical Management System opens the door for efficient, automated management of TSV chemistries. With new processes come elaborate technical challenges, but building on over a quarter century of experience in maintaining control of complex chemical applications at the forefront of technology helps us conquer new hurdles.”
With these installations the Quali-Fill line of products are established as a key standard for chemical management in the TSV process, as leading manufacturers move from the R&D stage into high volume manufacturing. Quali-Fill’s flexibility is able to address the needs of each customer’s specific process chemistry, despite varying materials and techniques. Quali-Fill maintains optimal on-line control over process chemistry, resulting in a smooth process and saving chip producers from voids and excessive waste.