ECI Presents New Technologies for TSV

ECI's world-leading R&D scientists publish their latest findings in a short infographic entitled "Non Reagent Metrology for Modern TSV Copper Plating Baths."

This information was presented on April 15th at the 2016 IEEE Workshop on Microelectronics and Electron Devices at Boise State University in Idaho, USA.

Co-authored by Michael Pavlov, Danni Lin, Eugene Shalyt, and Peter Bratin, please click this link to read the presentation.