ECI Technology Wins Multi-Million Dollar Order from Major OSAT

Quali-Fill Chemical Management Systems for Wafer Level Packaging

USA, October 27, 2016 – ECI Technology, Inc. announced it has received a multi-million dollar order from a major OSAT in Taiwan for Quali-Fill® Chemical Management Systems. ECI’s Quali-Fill systems provide fully automated online chemical metrology and smart dosing capabilities for manufacturing of advanced Wafer Level Packaging (WLP).

Quali-Fill systems incorporate newly developed metrology techniques to target the needs of the advanced packaging market for exacting analytical performance with significant savings and yield improvements. Based on a modular design, the system is capable of supporting multiple plating tools and all known chemistries for Cu, SnAg, Sn, Ni, and Au. Quali-Fill provides a universal chemical monitoring and control solution with supplemental capabilities for analyzing contaminants and by-products, delivering superior process control and significantly reduced cost of ownership.

“We are extremely pleased that ECI’s latest generation of Quali-Fill has been selected and qualified by one of the largest OSATs in Taiwan for 300 mm WLP manufacturing.” said Marianna Rabinovitch, CEO of ECI Technology, Inc.

Quali-Fill QFDS Chemical Management System

About ECI Technology, Inc.

Established in 1987, ECI Technology, Inc. is the leading global provider of chemical management systems for electrochemical deposition, surface preparation, and etch for the semiconductor industry. The company is driving chemical metrology innovations, empowering customers with improved control and monitoring of their manufacturing. ECI Technology has worldwide representation and local offices in Taiwan, Korea, and Japan. For more information, visit

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Kia Low, Ph.D.