Quali-Fill Chemical Management System provides analysis and dosing for Electroplating or Electroless TSV and Wafer Level Packaging (WLP) applications.  Quali-Fill systems feature a modular design capable of maintaining entire Bump, RDL, UBM, or Cu Pillar processes.  The system consists of a Master module and one or more Satellite modules, controlled by the Master.  Each module is dedicated for analysis of a specific chemsitry, such as Cu, SnAg, Ni, or Au.  Quali-Fill can be extended in the field by adding Satellite modules for additional chemistries. Coupled with Quali-Dose, the system automatically manages your plating processes with maximum efficiency. It is qualified as "Process Of Record" in the world's most advanced semiconductor manufacturing facilities.