| Plating Bath | Component | Accuracy | Repeatability |
|---|---|---|---|
| Electrolytic Applications | |||
| Copper Inorganic | Cu | 3% | 3% |
| Chloride | 3% | 2% | |
| Sulfuric Acid | 3% | 2% | |
| Copper Organic | Accelerator | 5% | 4% |
| Suppressor | 5% | 4% | |
| Leveler | 5% | 4% | |
| Tin Silver | Sn | 5% | 5% |
| Silver | 5% | 4% | |
| Acid | 4% | 3% | |
| Primary | 5% | 4% | |
| Secondary | 5% | 4% | |
| Complexer | 5% | 4% | |
| Nickel | Ni | 3% | 2% |
| Anode Activator | 3% | 2% | |
| Boric Acid | 3% | 2% | |
| Wetting Agent | 5% | 4% | |
| pH | 0.1pH | 0.05pH | |
| Gold | Au | 5% | 5% |
| SO3 | 5% | 4% | |
| Specific Gravity | 0.01g/cm3 | 0.01g/cm3 | |
| pH | 0.1 | 0.1 | |
| Palladium | Pd | 5% | 4% |
| Additive A | 5% | 4% | |
| pH | 0.1 | 0.1 | |
| Electroless Applications | |||
| Cleaner | MCL 10 | 5% | 5% |
| Activator | MCT 14 | 5% | 5% |
| H2SO4 | 0.2% | 0.1% | |
| E-less Cobalt | Cobalt | 3% | 3% |
| pH | 0.1 | 0.05 | |
| E-less Nickel | Ni | 2% | 2% |
| pH | 0.1 | 0.05 | |
| E-less Gold | Au | 7.5% | 5% |
| TDS-20-A | 5% | 5% | |
| TDS-20-M5 | 7.5% | 5% | |
| pH | 0.1 | 0.05 | |
| E-less Palladium | Pd | 5% | 5% |
| Complexing Agent | 10% | 10% | |
| Reducing Agent | 10% | 10% | |
| pH | 0.1 | 0.05 | |
| E-less Flash Gold | Au | 5% | 5% |
| Complexing Agent | 5% | 5% | |
| Reducing Agent | 10% | 10% | |
| pH | 0.1 | 0.05 | |
| E-less Heavy Gold | Au | 3% | 3% |
| Complexing Agent | 5% | TBD | |
| Reducing Agent | 5% | TBD | |
| pH | 0.1 | 0.05 | |
