Surface-Scan QC-200

Copper and Silver wires are rapidly gaining a foothold as interconnection materials in semiconductor packaging applications because of their advantages over gold. These advantages include up to 90% cost reduction, superior electrical and thermal conductivity, less intermetallic growth, greater reliability of the bond at elevated temperatures and higher mechanical stability. One of the disadvantages of copper wires is that copper tends to undergo oxidation at relatively low temperatures.
Sequential Electrochemical Reduction Analysis (SERA) can measure copper oxidation and thus help study and optimization of wirebonding processes utilizing copper wire. Incorporating proven techniques, QC-200 can analyze pure copper as well as copper protected with OSP. QC-200 can help you understand how, when and how much oxidation appears on your wires under different conditions and types of atmospheres.

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